Correlation of Chemical Microstructure with Solderability of PCBs
Source abstract
Abstract
A combination of analytical methods was used on printed circuit board coupons to conclude the following: (1) while steam ageing deteriorates solderability of tinned coupons, it does not increase the oxide thickness or tin-lead ratio of the surface (top 50 Angstroms) of tinned coupons; (2) therefore, some other factor, probably oxidation of the copper or tin/copper intermetallic substrate, determines solderability of the coupons.
Source: crossref · Quality: baseline
Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
The Center for Materials Characterization, University of North Texas, Denton, Texas, USA
Advanced Manufacturing Technology, Motorola Inc., Scottsdale, Arizona, USA
References (11)
Show source-provided references
1. Hagge J.K. · 1984
2. Marshall, J.L. and Miiller, D.E. Proceedings 14th Annual Electronics Manufacturing Seminar, Naval Weapons Center, China Lake, CA, p.239 (1990).
3. Klein Wassink R.J. · 1989
4. Kwoka, M.A. and Mullenix, P.D. Proceedings 14th Annual Electronics Manufacturing Seminar, Naval Weapons Center, China Lake, CA, p.269 (1990).
5. For · Journal of Vacuum Science and Technology · 1980 · 17 · 314
6. 10.1366/000370279492585910.1366/0003702794925859 ↗
7. Farrell T. · 1976 · 87
8. Grondahl, V.J., Proceedings 14th Annual Electronics Manufacturing Seminar, Naval Weapons Center, China Lake, CA, p.309 (1990).
9. Hansen M. · 1958
10. Lumsden J.B. · 1986 · 10
11. Wagner C.D. · 1979