Relationship of Corner Cracking in Multilayer Board Holes to Pyrophosphate Copper Plate
Source abstract
Abstract
In this paper, reproduced by permission of the Institute of Printed Circuits (USA), the authors discuss the problem of corner cracking in multilayer boards in relation to the electrodeposition of copper from the pyrophosphate electrolyte.
Only a short abstract or summary was supplied by the source.
Source: openalex_inverted_index · Quality: short
Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · Material Properties and Processing · Recycling and Waste Management Techniques
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References
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