Alternatives to CFC‐113 for Cleaning Printed Circuits

That the provisions of the Montreal Protocol (1987) are inadequate is a well‐known fact. The first revision of the Protocol will be approved by the Parties in June 1990, but the new provisions are still being discussed at the time of writing (December 1989). This paper discusses the various possibilities as to the available technologies which can replace current and future restricted cleaning solvents, as applied to the electronics assembly industry. It places particular emphasis on surface mount technology, as well as conventional assemblies.