journal article·2004-06-01

Assessing lead-free intellectual property

Paul Casey, Michael Pecht

Circuit World· Volume 30· Issue 2
Publisher page

Abstract

This paper presents the analysis of information collected from numerous patent searches on lead-free alloys. The significance of claim structure and content is discussed in view of the growing number of lead-free patents. Patent analysis software was developed to effectively compare over 350 lead-free alloy patents. A case study was conducted to assess Sn-Ag-Cu and special purpose lead-free candidate alloy intellectual property. The results show that there are a number of patents and patent applications that may affect the use of “popular” Sn-Ag-Cu formulations.
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Research context

OpenAlex topics: Intellectual Property and Patents · Innovation Policy and R&D

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

CALCE Electronic Products and Systems Center, University of Maryland, College Park, Maryland, USA

References (17)

Show source-provided references
1. Cookson Electronics Corp. (2003), “Partnering With the Global Electronics Industry in the Transition to Lead-Free Joining Solutions”, Available at: .
2. Cookson Group (1990), “Low toxicity alloy compositions for joining and sealing”, US Patent 4929423. 1999-05-29.
3. Ecosolder International Ltd (2002), “Lead free solder”, US Patent 6416883. 2002-07-09.
4. Engelhard Corp. (1988), “Low toxicity corrosion resistant solder”, US Patent 4778733. 1988-11-18.
5. Ford Motor Co. (1999), “Lead-free solder compositions”, US Patent 5863493. 1999-01-26.
6. Fujitsu Ltd (2002), “Soldering method and soldered joint”, European Patent Application 1196015A1. 2002-02-14.
7. Hitachi Ltd (2001), “Electronic component connected by lead-free solder”, Japanese Publication 2001-358456. 2001-12-26.
8. H-Technologies Group (2002), “Lead-free solder compositions”, US Patent Application 20020155024. 2002-10-24.
9. Iowa State University Research Foundation (2001), “Lead-free solder”, US Patent 6231691. 2001-05-15.
10. NEC Toppan Circuit Solutions Inc. (2002), “Solder, method for processing surface of printed wiring board, and method for mounting electronic part”, European Patent Application 1213089A1. 2002-06-12.
11. Nikkei Electronics Asia (2001), “Pb-free solder patent problems finally resolved”, Available at: .
12. Oatey Co. (1989), “Lead- and antimony-free solder composition”, US Patent 4879096. 1989-11-07.
13. Senju Metal Industry Co. (2002), “Lead-free paste for reflow soldering”, European Patent Application 1180411A1. 2002-02-20.
14. Senju Metal Industry Co. and Matsushita Electric Industrial Co. (1997), “Lead-free solder alloy”, Japanese Patent 3299091. 1997-04-08.
15. Senju Metal Industry Co. and Matsushita Electric Industrial Co. (1998), “Lead free solder alloy”, Japanese Publication 01-0052791. 1998-02-24.
16. Senju Metal Industry Co. and Matsushita Electric Industrial Co. (2000), “High temperature solder”, Japanese Patent 3027441. 2000-01-28.
17. Sohn, J. (2002), “Are lead-free solder joints reliable?”, Circuits Assembly, pp. 32-5.