Factors Involved in the Design and Manufacture of Bonded Heat Sinks
Source abstract
Abstract
A review has been made of the various factors involved in the design and manufacture of bonded heat sinks for printed circuit boards. Among the factors discussed are the design of heat sink thicknesses and the interrelationship with component lead geometry, the design of heat sink geometry as related to the fabrication of the heat sinks and bonding media, and the complexities of the bonding process itself.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · 3D IC and TSV technologies · Adhesion, Friction, and Surface Interactions
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References
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