PWB Interconnect Strategy Using a Full Build Electroless Copper Plating System
Source abstract
Abstract
Two current full build electroless copper deposits were investigated. This paper demonstrates that there are fundamental differences in the nature of their deposits. The consequences of these differences are highlighted for the PWB manufacturer.
Only a short abstract or summary was supplied by the source.
Source: openalex_inverted_index · Quality: short
Research context
OpenAlex topics: Electrodeposition and Electroless Coatings · Copper Interconnects and Reliability · Semiconductor materials and devices
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References
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