Fluxless Wave Soldering
Source abstract
Abstract
Fluxless wave soldering in a nitrogen atmosphere was investigated for epoxy‐fibreglass circuit board coupons having bare copper and solder‐coated through‐holes. The Reduced Oxide Soldering Activation (ROSA™) pretreatment was found to consistently provide good hole filling and through‐hole solder joints of excellent appearance. For preheated coupons, low levels of residual oxygen and short exposure to air after the ROSA treatment were found to have no effect
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · Semiconductor Lasers and Optical Devices · 3D IC and TSV technologies
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References
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