Analysis and Evaluation of TAB Bonds

Tape automated bonding (TAB) is one technology which is becoming widely adopted for interconnecting integrated circuits to a substrate or package. Both destructive and non‐destructive test methods for evaluation of TAB bonds are analysed and criticised. The key parameters and general guidelines of a destructive beampull test set‐up are identified and presented. The key features of four different non‐destructive test methods are described and discussed. It is found that no universal solution exists for non‐destructive evaluation of TAB bonds although some methods may be more useful than others under certain conditions and constraints. Data and experimental procedure are presented for correlation of scanning laser acoustic microscopy and beampull data.