No Clean Mass Reflow of Large Plastic Ball Grid Array Packages
Source abstract
Abstract
A no‐clean mass reflow process for 396‐pin, 324‐pin and 225‐pin over moulded plastic pad array carriers (OMPACs) or plastic ball grid array (BGA) is presented. Emphasis is placed on the OMPAC assembly parameters such as the design, material and process of the packages and printed circuit board (PCB), solder paste, stencil design, printing technology, pick and place, mass re‐flow and inspection. Furthermore, cross‐sections and the ‘popcorn’ effect of the OMPAC assembly are provided and discussed.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · 3D IC and TSV technologies · Electromagnetic Compatibility and Noise Suppression
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References
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