High quality factor fractal inductor with complementary split-ring array inclusion

Purpose This paper aims to present an efficient method to improve quality factor of printed fractal inductors based on electromagnetic band-gap (EBG) surface. Design/methodology/approach Hilbert fractal inductor is designed and simulated using high-frequency structural simulator. To improve the quality factor, an EBG surface underneath the inductor is incorporated without any degradation in inductance value. Findings The proposed inductor and Q factor are measured based on well-known three-dimensional simulator, and the results are compared experimentally. Practical implications The proposed method was able to significantly decrease the noise with increase in the speed of radio frequency and sensor-integrated circuit design. Originality/value Fractal inductor is designed and simulated with and without EBG surfaces. The measurement of printed circuit board prototypes demonstrates that the inclusion of split-ring array as EBG surface increases the quality factor by 90 per cent over standard fractal inductor of the same dimensions with a small degradation in inductance value and is capable of operating up to 2.4 GHz frequency range.