A new small CTE system from COPNA resin/E‐glass fabrics
Source abstract
Abstract
Based on the superior properties of the COPNA resin laminate exhibiting Tg at 255∞C, small CTE at 5‐7 ppm (xy‐axis) and at 29 ppm (z‐axis), reliability of both two‐layered and six‐layered printed wiring boards using COPNA resin as a matrix were evaluated. In the case of the two‐layered system, it exhibited higher reliability than the FR‐4 graded epoxy‐resin laminate in the entire tests, and exhibited higher reliability than the BT resin laminate in the THB test, heat‐shock test, and heat‐cycle test. In the case of the six‐layered system, it also exhibited higher reliability than the BT system in both heat‐shock test and PC test.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · 3D IC and TSV technologies · Mechanical Behavior of Composites
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References
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