Assessment of blind via holes – an alternative approach

Purpose To present a simple way of assessing blind vias, making failure analysis easier to perform and generating less controversy. Design/methodology/approach The paper describes a procedure that may be used to examine blind via hole interconnections for routine testing or during failure analysis of a printed circuit board. Findings The technique described complements existing methods for assessing vias. Originality/value The paper details a new method of via assessment that can be an alternative to established techniques.