High Strength, Low Profile Copper Foil for High Performance PCBs

A new high strength, low profile copper foil (AM) has been developed by the authors' company. This foil is designated AM foil, which refers to its advanced metallurgy. The unique attributes of this foil arise from its unconventional processing approach and the resulting microstructure. An extremely small and uniform grain structure enhances the metallurgy and decreases the foil profile. Random crystal orientation and high nucleation density eliminate porosity for all foils of various thickness. Other benefits related to this high strength and low profile foil include good handleability, outstanding etching performance, better control of dielectric thickness, very high elongation to reduce innerlayer cracks, improved oxide adhesion, as well as other advantages.