Wave Soldering of SMDs—A Smart Approach From Science to Practice
Source abstract
Abstract
This paper describes some fundamental aspects involved in wave soldering of surface mount devices. Calculations are given on capillary behaviour to provide a greater understanding of the problems involved in wetting SMDs. The soldering of SMDs with a new single wave soldering concept will also be featured.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · Adhesion, Friction, and Surface Interactions · 3D IC and TSV technologies
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References
Reference metadata was not supplied for this record.