article·2000-12-01

Predicting HDI design density

Happy Holden, Richard Charbonneau

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Abstract

This paper reveals a new methodology for predicting the most efficient design rules to follow for high density printed wiring boards prior to physical layout. The only input is from a schematic diagram, parts list and proposed board size. The methodology attempts to a priori determine the wiring capabilities of different PWB designs for a given product application. The particular focus is the difference between through‐hole and HDI designs.
Source: openalex_inverted_index · Quality: baseline

Research context

OpenAlex topics: 3D IC and TSV technologies · VLSI and FPGA Design Techniques · Electronic Packaging and Soldering Technologies

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