Predicting HDI design density
Source abstract
Abstract
This paper reveals a new methodology for predicting the most efficient design rules to follow for high density printed wiring boards prior to physical layout. The only input is from a schematic diagram, parts list and proposed board size. The methodology attempts to a priori determine the wiring capabilities of different PWB designs for a given product application. The particular focus is the difference between through‐hole and HDI designs.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: 3D IC and TSV technologies · VLSI and FPGA Design Techniques · Electronic Packaging and Soldering Technologies
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References
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