Organic Microelectronic Packages: Challenges for a PCB Manufacturer
Source abstract
Abstract
The driving forces behind recent significant improvements in organic packages for microelectronic applications are electrical performance, product weight, size and manufacturing cost. A very careful selection of optimum manufacturing processes, equipment and materials, and stringent control of critical manufacturing operations are prerequisites for success in this emerging market place. Major technical and business related challenges to a printed circuit board manufacturer who plans to enter this market are discussed.
Source: crossref · Quality: baseline
Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · 3D IC and TSV technologies
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
Sindelfingen Technologie Produkte (IBM), Sindelfingen, Germany
References (7)
Show source-provided references
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