“System in package technology” – design for manufacture challenges

Purpose To present key challenges associated with the evolution of system‐in‐package technologies and present technical work in reliability modeling and embedded test that contributes to these challenges. Design/methodology/approach Key challenges have been identified from the electronics and integrated MEMS industrial sectors. Solutions to optimising the reliability of a typical assembly process and reducing the cost of production test have been studied through simulation and modelling studies based on technology data released by NXP and in collaboration with EDA tool vendors Coventor and Flomerics. Findings Characterised models that deliver special and material dependent reliability data that can be used to optimize robustness of SiP assemblies together with results that indicate relative contributions of various structural variables. An initial analytical model for solder ball reliability and a solution for embedding a low cost test for a capacitive RF‐MEMS switch identified as an SiP component presenting a key test challenge. Research limitations/implications Results will contribute to the further development of NXP wafer level system‐in‐package technology. Limitations are that feedback on the implementation of recommendations and the physical characterisation of the embedded test solution. Originality/value Both the methodology and associated studies on the structural reliability of an industrial SiP technology are unique. The analytical model for solder ball life is new as is the embedded test solution for the RF‐MEMS switch.