Mechanical Modelling for Printed Circuit Boards
Source abstract
Abstract
The fundamental considerations and mechanical integrity of printed circuit boards are reviewed, and mechanical analysis and modelling techniques provided. Fine line element techniques are utilised to model temperature distribution, thermally induced loading and moisture diffusion. Experimental testing techniques are used to make reliability assessment and to optimise material and processing developments.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · 3D IC and TSV technologies · Material Properties and Processing
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References
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