Failure analysis of electronic components and interconnection systems

Purpose The failure analysis of electronic components and interconnection systems such as integrated circuits, printed circuit board assemblies, and hybrid devices is discussed. Design/methodology/approach How the analytical techniques used for physical and chemical analysis, which include X‐ray radiography, optical microscopy and scanning electron microscopy/energy dispersive X‐ray spectroscopy, are used. Findings Examples from recent case studies are given to illustrate the work. Originality/value The paper demonstrates how the failure analysis of an electronic component or interconnection system is conducted, and what can be learnt from the investigation.