Immersion tin as a high performance solderable finish for fine pitch PWBs
Source abstract
Abstract
A new high performance immersion tin incorporating a co-deposited organic provides a highly solderable PWB surface finish. The process is described and includes solderability data after accelerated aging and extended processing. Studies of SIR, metallic dendritic growth and ionic contamination are included. A final section shows the benefits for fine pitch assembly, including the yield improvements seen at reflow, ICT and final inspection. The reliability questions are answered and conclude that the flat solderable tin process provides a cost-effective and yield-enhancing planar alternative to Nickel-Gold, HASL and OSPs.
Source: crossref · Quality: baseline
Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · 3D IC and TSV technologies · Advanced materials and composites
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
Alpha PC Fab, Londonderry, New Hampshire, USA
References (8)
Show source-provided references
1. Banks, Burnett, Cho, DeMarco and Mawer (1996), “The effects of solder joint voiding on plastic ball grid array reliability”, SMI Proceedings, Vol. 1, pp. 121-6.
2. Hunt, C. , “Measuring and predicting solderability”, National Physical Lab.
3. IPC-TM- 650 Test Methods Manual.
4. Kakeshita, S . and Kawanaka, H. (1982), Journal of Matls. Sci., Vol. 17, pp. 2560-6.10.1007/BF00543888 ↗
5. Mir, A ., Semensi, J. et al., “Internal Dexter technical papers”, Dexter Electronic Materials, Londonderry, NH.
6. Ormerod, D.H . (1997), “The development and use of a modified immersion tin as a high performance solderable finish”, Dexter Electronic Materials, September.
7. Smetana, J. Jr (1998), “Alternate PCB surface finishes”, Future Circuits, DSC Communications, Alcatel.
8. Von Odfried, I . (1993), “Alternativen zur Heißverzinnung”, Galvanotechnik 84.