A Reliability Study of Fuzz Button Interconnects
Source abstract
Abstract
This paper presents the methods and results of load, deflection and electrical contact resistance experiments for reliable electronic module design using fuzz button technology. Both beryllium copper (BeCu) and molybdenum (Mo) fuzz button contacts were examined, as a function of wire diameter, button diameter and button density.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies
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