Low Cost Solder Bumped Flip Chip MCM‐L Demonstration
Source abstract
Abstract
A low cost multichip module employing solder bumped flip chips mounted on an organic substrate was demonstrated. This functional prototype was used to help assess the preliminary feasibility of low temperature solder bumped flip chip applications, from wafer design, sourcing and bumping, substrate design and fabrication, to MCM‐L assembly.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: VLSI and FPGA Design Techniques · 3D IC and TSV technologies · VLSI and Analog Circuit Testing
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