Limits of copper plating in high aspect ratio microvias
Source abstract
Abstract
This paper explores the capability of electroless copper deposition plus acid copper electroplating to metallize high aspect ratio microvias.
Only a short abstract or summary was supplied by the source.
Source: openalex_inverted_index · Quality: short
Research context
OpenAlex topics: Electrodeposition and Electroless Coatings · Nanoporous metals and alloys · Electronic Packaging and Soldering Technologies
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References
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