Alternative Solders for Electronics Assemblies
Source abstract
Abstract
This is the first of two papers reporting work carried out under a programme sponsored by the Department of Trade and Industry (DTI), involving collaboration between the International Tin Research Institute, GEC‐Marconi Ltd, BNR (Europe) Ltd and Multicore Solders Ltd. Part 1 describes the methodology used to select a number of candidate alloys as possible suitable lead‐free alternatives to tin‐lead solder.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies
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References
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