Cumulative degradation methodology to predict reliability of electronic systems
Source abstract
Abstract
Purpose The purpose of this paper is to describe a novel methodology for predicting reliability for consumer electronics or any other hardware systems that experience a complex lifecycle environmental profile. Design/methodology/approach This Physics-of-Failure–based three-step methodology can be used to predict the degradation rate of a population using a Monte Carlo approach. The three steps include: using an empirical equation describing the degradation of a performance metric, a degradation consistency condition and a technique to account for cumulative degradation across multiple life-cycle stress conditions (e.g. temperature, voltage, mechanical load, etc.). Findings Two case studies are provided to illustrate the methodology including one related to repeated touch-load induced artifacts for displays. Originality/value This novel methodology can be applied to a wide range of applications from mechanical systems to electrical circuits. The results can be fed into the several stages of engineering validation to speed up product qualification.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · Integrated Circuits and Semiconductor Failure Analysis · Semiconductor materials and devices
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References
Reference metadata was not supplied for this record.