article·2008-05-16

Hybrid modeling of woven fibre reinforced metal matrix composite for multilayer circuit boards

Kin Huat Low, Yuqi Wang

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Abstract

Purpose – To present a method to model woven fibre reinforced metal matrix composite for multilayer circuit boards.
Only a short abstract or summary was supplied by the source.
Source: openalex_inverted_index · Quality: short

Research context

OpenAlex topics: Additive Manufacturing and 3D Printing Technologies · Structural Analysis and Optimization · Mechanical Behavior of Composites

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References

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