Investigation of Copper Deposition on Printed Circuit Boards Using Taguchi Methods
Source abstract
Abstract
This study describes how the copper deposition rate and the degree of copper coverage in the holes on printed circuit boards were investigated. The composition of the chemical copper solution was varied, and consequently the deposition parameters were changed. By using Taguchi methods, the level of significance of the process parameters was determined.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Industrial Vision Systems and Defect Detection · Recycling and Waste Management Techniques · Additive Manufacturing and 3D Printing Technologies
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