Solder failure mechanisms in single‐sided insertion‐mount printed wiring boards
Source abstract
Abstract
This paper presents the defects that occur during the assembly and manufacturing of solder joints in single‐sided insertion‐mount printed wiring boards (PWBs). Each type of defect is discussed, with particular focus on how these defects are related to solderability issues, the mechanisms of failure due to defect‐induced failure accelerators, and the effect of the defect on solder joint reliability.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · 3D IC and TSV technologies · Flexible and Reconfigurable Manufacturing Systems
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References
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