Electrochemical Migration in Multichip Modules
Source abstract
Abstract
Laminated substrates are used widely in the manufacture of multichip modules (MCM-L) by the electronic packaging industry. Of late, the thrust has been towards higher density circuitry to achieve improved performance and reduced size. This has led to the use of finer lines and spacings, smaller drilled holes and buried vias in organic laminates leading to reliability issues such as electrochemical migration. One of the forms of electrochemical migration is known as conductive filament formation. Conductive filament formation is an electrochemical process. In accelerated environments of temperature and humidity,organic laminates can develop a loss of insulation resistance between conductors, eventually resulting in loss of electrical function of the circuit. The paper aims at discussing electrochemical migration in general, and conductive filament formation in particular, and its impact on the reliability of MCM-L.
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Research context
OpenAlex topics: Copper Interconnects and Reliability · Electronic Packaging and Soldering Technologies · Electrodeposition and Electroless Coatings
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
Delco Electronics Corporation, Kokomo, Indiana, USA
CALCE Electronic Packaging Research Center, University of Maryland, College Park, Maryland, USA
Rockwell International Corporation, Cedar Rapids, Iowa, USA
References (9)
Show source-provided references
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7. ‘Assessing Time-to-Failure Due to Conductive Filament Formation in Multi-Layer Organic Laminates’10.1109/96.311773 ↗
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