Overview of Tape Automated Bonding Technology
Source abstract
Abstract
A review of state‐of‐the‐art technology pertinent to tape automated bonding (for fine pitch, high I/O, high performance, high yield, high volume and high reliability) is presented. Emphasis is placed on a new understanding of the key elements (for example, tapes, bumps, inner lead bonding, testing and burn‐in on tape‐with‐chip, encapsulation, outer lead bonding, thermal management, reliability and rework) of this rapidly moving technology.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: 3D IC and TSV technologies · Music Technology and Sound Studies · Electronic Packaging and Soldering Technologies
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