Alternative Solders for Electronics Assemblies

James H. Vincent; B. P. Richards; Danielle Wallis; I.A. Gunter; M. E. Warwick; H. Steen; Paul G. Harris; Mark Whitmore; S.R. Billington; A.C. Harman; Eric Knight

doi:10.1108/eb046210

article·1993-02-01

Alternative Solders for Electronics Assemblies

James H. Vincent, B. P. Richards, Danielle Wallis, I.A. Gunter, M. E. Warwick, H. Steen, Paul G. Harris, Mark Whitmore, S.R. Billington, A.C. Harman, Eric Knight

Circuit World

Publisher page

Source abstract

Abstract

This is the second of two papers reporting work carried out under a programme sponsored by the Department of Trade and Industry (DTI), involving collaboration between the above companies and research centres. The objectives of the programme are to identify/develop lead‐free alternatives to Sn‐40Pb solder, progress towards the development of which is described in this paper. A number of promising alloys have been selected for trial in a further round of experimentation.

Source: openalex_inverted_index · Quality: baseline

Research context

Metals & alloys

OpenAlex topics: Electronic Packaging and Soldering Technologies · 3D IC and TSV technologies

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

References

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