The production of large format backplanes—part 1
Source abstract
Abstract
Reviews the equipment and processing challenges involved in the initial stages of the manufacture of large area back plane printed wiring boards and describes some of the techniques employed by APW Electronic Solutions.
Only a short abstract or summary was supplied by the source.
Source: openalex_inverted_index · Quality: short
Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · 3D IC and TSV technologies
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References
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