The Solderability Testing of Surface Mount Devices Using the GEC Meniscograph Solderability Tester
Source abstract
Abstract
This paper outlines some techniques developed at GEC Research Laboratories to extend the range of specimen types which may be solderability tested by the wetting balance method. Particular emphasis is placed upon surface mounting components and substrates, which have not proved amenable to quantitative testing by conventional means.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · 3D IC and TSV technologies · Adhesion, Friction, and Surface Interactions
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References
Reference metadata was not supplied for this record.