Microvias for Low Cost High Density Interconnects

The first-ever book on microvias, the new high-density interconnect technology changing the nature of printed circuit boards–and driving the mobile electronic revolution. A must for electronics and mechanical engineers, this intensive introduction covers microvia technology expertly surveys all major techniques: mechanical NC drilling, laser drilling, photo-defined, chemical etching, and conductive ink formation. Features a detailed survey of the work of leading companies–and their products–from around the globe.