Thermoelectric Modules: Key Issues in Architectural Design and Contact Optimization

Abstract Interplay between the phonons and electrons makes thermoelectric engineering enigmatic.In recent years, substantial improvement in the performance of thermoelectric materials has drawn considerable attention in experimenting their prospective applications in the thermoelectric technology. It serves as a bond between the thermoelectric alloys/materials and the modules/devices and so needs to be meticulously planned, engineered and integrated to gratify the performance of the thermoelectric products either for cooling or power generation. Here, the principle of thermoelectricity has been discussed along with the different feasible architectures and synthesis methodologies. In addition, the review also discusses the role of contact engineering, as the reliability of the thermoelectric devices depends on the overall assemblage. Moreover, thermoelectric applications are limited to niche markets wherever the need of reliability surpasses the requirement of conversion efficiency. Thus, contact issues which includes thermomechanical stresses at the interface, bonding strength and resistance at the interface are also discussed.