journal article·2012-01-10

Atomic Layer Deposition of Osmium

Jani Hämäläinen, Timo Sajavaara, Esa Puukilainen, Mikko Ritala, Markku Leskelä

Chemistry of Materials· Volume 24· Issue 1
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Abstract

Growth of osmium thin films and nanoparticles by atomic layer deposition is described. The Os thin films were successfully grown between 325 and 375 °C using osmocene and molecular oxygen as precursors. The films consisted of only Os metal as osmium oxides were not detected in X-ray diffraction measurements. Also the impurity contents of oxygen, carbon, and hydrogen were less than 1 at % each at all deposition temperatures. The long nucleation delay of the Os process facilitates either Os nanoparticle or thin film deposition. However, after the nucleation delay of about 350 cycles the film growth proceeded linearly with increasing number of deposition cycles. Also conformal growth of Os thin films on three-dimensional (3-D) structures was confirmed.
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Research context

OpenAlex topics: Semiconductor materials and devices · Electronic and Structural Properties of Oxides · Catalytic Processes in Materials Science

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Affiliations

Laboratory of Inorganic Chemistry, Department of Chemistry, University of Helsinki, P.O. Box 55, FI-00014 Helsinki, Finland

Accelerator Laboratory, Department of Physics, University of Jyväskylä, P.O. Box 35, FI-40014 Jyväskylä, Finland

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