journal article·2008-11-25

Rapid SiO2 Atomic Layer Deposition Using Tris(tert-pentoxy)silanol

B. B. Burton, M. P. Boleslawski, A. T. Desombre, S. M. George

Chemistry of Materials· Volume 20· Issue 22
Publisher page

Abstract

Rapid SiO 2 atomic layer deposition (ALD) can deposit very thick and conformal SiO 2 films by silanol exposure to surfaces covered with Al catalysts. In this study, we have explored the growth of rapid SiO 2 ALD films using liquid tris( tert -pentoxy)silanol (TPS). The SiO 2 film thicknesses were determined using quartz crystal microbalance and X-ray reflectivity measurements. The SiO 2 film thicknesses deposited during one silanol exposure were dependent on the substrate temperature, silanol pressure, and silanol exposure time. The dependence of the SiO 2 growth on these parameters helped to establish the mechanism of rapid SiO 2 ALD. For TPS exposures of 1 s, the SiO 2 ALD growth rate was larger at lower temperatures and higher TPS pressures. SiO 2 ALD thicknesses of 125−140 Å were observed at the highest TPS pressures of ∼1 Torr at lower temperatures of 150 and 175 °C. Rapid SiO 2 ALD is believed to result from the growth of siloxane polymer chains at the Al-catalytic sites and the cross-linking of these polymer chains to form a dense SiO 2 film. The results indicated that higher TPS fluxes increase the siloxane polymerization rates. Likewise, the lower temperatures reduce the cross-linking rates between the siloxane polymers that self-limit the SiO 2 deposition. To explore the rate of cross-linking between the siloxane polymers, experiments were conducted where small TPS micropulses were employed with different delay times between the micropulses. The SiO 2 ALD thicknesses decreased with increasing delay times. This behavior suggested that the longer delay times produced more cross-linking that self-limits the SiO 2 deposition. Other experiments showed that higher temperatures produced faster nucleation of the rapid SiO 2 ALD. The nucleation was nearly immediate at the higher temperatures and could be as long as 10 s at the lower temperatures. The growth kinetics of rapid SiO 2 ALD can be understood in terms of the temperature dependence of nucleation and cross-linking and the pressure dependence of the siloxane polymerization rate. Rapid SiO 2 ALD was also dependent on the presence of pyridine derivatives in the TPS. These Lewis base impurities catalyze both the initial nucleation and the cross-linking reaction during rapid SiO 2 ALD.
Source: openalex_inverted_index · Quality: baseline

Research context

OpenAlex topics: Semiconductor materials and devices · Diamond and Carbon-based Materials Research · Copper Interconnects and Reliability

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

Department of Chemistry and Biochemistry and Department of Chemical and Biological Engineering, University of Colorado, Boulder, Colorado 80309, and SAFC Hitech, Sheboygan Falls, Wisconsin 53085

References (38)

Show source-provided references
1. George S. M. · J. Phys. Chem. · 1996 · 100 · 1312110.1021/jp9536763 ↗
2. Ritala M. · 2001
3. Wolf S. · 1986
4. Ferguson J. D. · Chem. Mater. · 2000 · 12 · 347210.1021/cm000313t ↗
5. Ferguson J. D. · Appl. Surf. Sci. · 2000 · 162 · 28010.1016/S0169-4332(00)00205-1 ↗
6. Klaus J. W. · Appl. Phys. Lett. · 1997 · 70 · 109210.1063/1.118494 ↗
7. Sneh O. · Surf. Sci. · 1995 · 334 · 13510.1016/0039-6028(95)00471-8 ↗
8. Du Y. · Thin Solid Films · 2005 · 491 · 4310.1016/j.tsf.2005.05.051 ↗
9. Du Y. · J. Phys. Chem. C · 2007 · 111 · 21910.1021/jp0638484 ↗
10. Klaus J. W. · Surf. Sci. · 2000 · 447 · 8110.1016/S0039-6028(99)01119-X ↗
11. Klaus J. W. · Science · 1997 · 278 · 193410.1126/science.278.5345.1934 ↗
12. Klaus J. W. · Surf. Rev. Lett. · 1999 · 6 · 43510.1142/S0218625X99000433 ↗
13. Gasser W. · Thin Solid Films · 1994 · 250 · 21310.1016/0040-6090(94)90188-0 ↗
14. Morishita S. · Jpn. J. Appl. Phys., Part 1 · 1995 · 34 · 573810.1143/JJAP.34.5738 ↗
15. Yamaguchi K. · Appl. Surf. Sci. · 1998 · 132 · 20210.1016/S0169-4332(98)00051-8 ↗
16. Lee J. H. · Jpn. J. Appl. Phys., Part 2 · 2004 · 43 · L32810.1143/JJAP.43.L328 ↗
17. Lim J. W. · ETRI J. · 2005 · 27 · 11810.4218/etrij.05.0204.0023 ↗
18. Miller K. A. · Thin Solid Films · 2001 · 397 · 7810.1016/S0040-6090(01)01474-2 ↗
19. Hausmann D. · Science · 2002 · 298 · 40210.1126/science.1073552 ↗
20. de Rouffignac P. · Electrochem. Solid-State Lett. · 2004 · 7 · G30610.1149/1.1814594 ↗
21. Zhong L. J. · Chem. Vap. Deposition · 2006 · 12 · 14310.1002/cvde.200506375 ↗
22. Zhong L. J. · J. Mater. Chem. · 2004 · 14 · 320310.1039/b406533f ↗
23. He W. · J. Appl. Phys. · 2003 · 94 · 365710.1063/1.1599976 ↗
24. Elam J. W. · Rev. Sci. Instrum. · 2002 · 73 · 298110.1063/1.1490410 ↗
25. Fabreguette F. H. · Thin Solid Films · 2005 · 488 · 10310.1016/j.tsf.2005.04.114 ↗
26. Ferguson J. D. · Thin Solid Films · 2000 · 371 · 9510.1016/S0040-6090(00)00973-1 ↗
27. Ferguson J. D. · Thin Solid Films · 2002 · 413 · 1610.1016/S0040-6090(02)00431-5 ↗
28. Ferguson J. D. · Chem. Mater. · 2004 · 16 · 560210.1021/cm040008y ↗
29. Gaul J. H. · Spectrosc. Lett. · 1983 · 16 · 65110.1080/00387018308062378 ↗
30. Smith D. L. · 1995
31. Hausmann D. M. · Chem. Mater. · 2002 · 14 · 435010.1021/cm020357x ↗
32. Petersen K. E. · IEEE Trans. Electron Devices · 1978 · 35 · 124110.1109/T-ED.1978.19259 ↗
33. Alexiadis A. · Macromol. Mater. Eng. · 2004 · 289 · 45710.1002/mame.200400011 ↗
34. Knoke S. · Macromol. Chem. Phys. · 2003 · 204 · 60710.1002/macp.200390028 ↗
35. Zechlin J. · Macromol. Chem. Phys. · 2000 · 201 · 51510.1002/(SICI)1521-3935(20000301)201:5<515::AID-MACP515>3.0.CO;2-E ↗
36. Kim S. H. · J. Catal. · 2000 · 193 · 17110.1006/jcat.2000.2917 ↗
37. Kim S. H. · Korean J. Chem. Eng. · 2002 · 19 · 110.1007/BF02706867 ↗
38. Kim S. H. · Catal. Lett. · 2000 · 68 · 710.1023/A:1019075218358 ↗