Phase Equilibria of the Cu-Si-Sn System at 700 and 500 °C
Source abstract
Abstract
Intermetallic compounds formed in solder joints have a substantial effect on reliability. Because Sn-based alloys are alternatives to lead-containing solders, phase equilibria of the Cu-Si-Sn system were investigated for quenched samples annealed at 700 and 500 °C for 30 days. Nine three-phase equilibria were well established at 700 °C, and a previously unknown ternary τ phase with a possible homogeneity interval in the range Cu76Sn7.8Si16.2-Cu85Sn7.6Si7.4 was found for the first time. The τ phase has a hexagonal structure with a = 8.012 nm and c = 5.04 nm. Six three-phase regions were identified in the isothermal region at 500 °C. In contrast with the isothermal region at 700 °C, the new ternary τ phase was not observed at 500 °C. The solubility of Si in e-Cu3Sn decreases from 12.8 to 1.4 at.%, and only small variations occur in the homogeneity ranges of η-Cu3Si and γ-Cu5Si.
Source: openaire · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · Aluminum Alloy Microstructure Properties · Metallurgical and Alloy Processes
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (38)
Show source-provided references
1. B.P. Richards, C.L. Levoguer, C.P. Hunt, K. Nimmo, S. Peters, and P. Cusack, An Analysis of the Current Status of Lead-Free Soldering, NPL, ITRI and DTI Joint Report About Pb-free Soldering, January 1999
2. IPC Roadmap, Guide for Assembly of Lead-Free Electronics, IPC, Northbrook, IL, 2000
3. M. Abtew and G. Selvaduray, Lead-Free Solders in Microelectronics, Mater. Sci. Eng. R, 2000, 27(5), p 95-14110.1016/S0927-796X(00)00010-3 ↗
4. K. Suganuma, Advances in Lead-Free Electronics Soldering, Curr. Opin. Solid State Mater. Sci., 2001, 5(1), p 55-6410.1016/S1359-0286(00)00036-X ↗
5. K.N. Tu and R.D. Thompson, Kinetics of Interfacial Reaction in Bimetallic Cu-Sn Thin Films, Acta Metall., 1982, 30(5), p 947-95210.1016/0001-6160(82)90201-2 ↗
6. A.J. Sunwoo, J.W. Morris, and G.K. Lucey, The Growth of Cu-Sn Intermetallics at a Pretinned Copper-Solder Interface, Metall. Trans. A, 1992, 23(4), p 1323-133210.1007/BF02665064 ↗
7. B.J. Lee, N.M. Hwang, and H.M. Lee, Prediction of Interface Reaction Products Between Cu and Various Solder Alloys by Thermodynamic Calculation, Acta Mater., 1997, 45(5), p 1867-187410.1016/S1359-6454(96)00325-4 ↗
8. S. Bader, W. Gust, and H. Hieber, Rapid Formation of Intermetallic Compounds Interdiffusion in the CuSn and NiSn Systems, Acta Metall., 1995, 43(1), p 329-337
9. D.R. Frear, D. Grivas, and J.W. Morris, Parameters Affecting Thermal Fatigue Behavior of 60Sn-40Pb Solder Joints, J. Electron. Mater., 1989, 18, p 671-68010.1007/BF02657518 ↗
10. P.L. Tu, Y.C. Chan, and J.K.L. Lai, Effect of Intermetallic Compounds on the Thermal Fatigue of Surface Mount Solder Joints, IEEE Trans. Compon. Packag. Manuf. Technol. B, 1997, 20(1), p 87-9310.1109/96.554534 ↗
11. Y.C. Chan, P.L. Tu, A.C. So, and J.K.L. Lai, Effect of Intermetallic Compounds on the Shear Fatigue of Cu/63Sn-37Pb Solder Joints, IEEE Trans, Compon. Packag. Manuf. Technol. B, 1997, 20(4), p 463-46910.1109/96.641516 ↗
12. L. Quan, D. Frear, D. Grivas, and J.W. Morris, Tensile Behavior of Pb-Sn Solder/Cu Joints, J. Electron. Mater., 1987, 16(3), p 203-20810.1007/BF02655488 ↗
13. R.E. Pratt, E.I. Stromswold, and D.J. Quesnel, Effect of Solid-State Intermetallic Growth on the Fracture Toughness of Cu/63Sn-37Pb Solder Joints, Compon. Packag. Manuf. Technol. A, 1996, 19(1), p 134-14110.1109/95.486625 ↗
14. M.H. Lee, D.H. Bae, D.H. Kim, and D.J. Sordelet, Synthesis of Ni-Based Bulk Metallic Glass Matrix Composites Containing Ductile Brass Phase by Warm Extrusion of Gas Atomized Powders, J. Mater. Res., 2003, 18(09), p 2101-210810.1557/JMR.2003.0295 ↗
15. N.F. Lashko, K.P. Sorokina, and A.N. Gorbunov, Strengthening of Silicon Monel, Met. Sci. Heat Treat., 1996, 6, p 48-49
16. H. Okamoto, Cu-Si (Copper-Silicon), J. Phase Equilib. Diffus., 2012, 33(5), p 415-41610.1007/s11669-012-0076-2 ↗
17. D. Shin, J.E. Saal, and Z.K. Liu, Thermodynamic Modeling of the Cu-Si System, CALPHAD, 2008, 32(3), p 520-52610.1016/j.calphad.2008.05.003 ↗
18. J.H. Shim, C.S. Oh, B.J. Lee, and D.N. Lee, Thermodynamic Assessment of the Cu-Sn System, Z. Metallk., 1996, 87(3), p 205-212
19. J. Miettinen, Thermodynamic Description of the Cu-Al-Sn System in the Copper-Rich Corner, Metall. Mater. Trans. A, 2002, 33(6), p 1639-164810.1007/s11661-002-0173-7 ↗
20. X.J. Liu, C.P. Wang, I. Ohnuma, R. Kainuma, and K. Ishida, Experimental Investigation and Thermodynamic Calculation of the Phase Equilibria in the Cu-Sn and Cu-Sn-Mn Systems, Metall. Mater. Trans. A, 2004, 35, p 1641-165410.1007/s11661-004-0073-0 ↗
21. W. Gierlotka, S.W. Chen, and S.K. Lin, Thermodynamic Description of the Cu-Sn System, J. Mater. Res., 2007, 22(11), p 3158-316510.1557/JMR.2007.0396 ↗
22. M. Li, Z.M. Du, C.P. Guo, and C.R. Li, Thermodynamic Optimization of the Cu-Sn and Cu-Nb-Sn Systems, J. Alloys Compd., 2009, 477(1), p 104-11710.1016/j.jallcom.2008.09.141 ↗
23. S. Fürtauer, D. Li, D. Cupid, and H. Flandorfer, The Cu-Sn Phase Diagram, Part I: New Experimental Results, Intermetallics, 2013, 34, p 142-14710.1016/j.intermet.2012.10.004 ↗
24. D. Li, P. Franke, S. Fürtauer, D. Cupid, and H. Flandorfer, The Cu-Sn Phase Diagram Part II: New Thermodynamic Assessment, Intermetallics, 2013, 34, p 148-15810.1016/j.intermet.2012.10.010 ↗
25. H.L. Lukas, I. Ansara, A.T. Dinsdale, and M.H. Rand (Eds.), COST507—Thermochemical Database for Light Metal Alloys, Vol. 18499, 1998, p 224-226
26. V.T. Deshpande and D.B. Direshmukh, Thermal Expansion of Tin in the β-γ Transition Region, Acta Crystallogr., 1962, 15, p 294-29510.1107/S0365110X62000742 ↗
27. M. Kantola and E. Tokola, X-ray Studies on the Thermal Expansion of Copper-Nickel Alloys, Ann. Acad. Sci. Fenn., 1967, 223, p 1-10
28. J.A. Lee and G.V. Raynor, The Lattice Spacings of Binary Tin-Rich Alloys, Proc. Phys. Soc. B, 1954, 67(10), p 73710.1088/0370-1301/67/10/301 ↗
29. H. Knödler, Über Kristallstruktur und strukturellen Zusammenhang der Phasen gamma und epsilon im System Kupfer-Zinn, Metall, 1966, 20(8), p 823-829, in German
30. M.H. Booth, J.K. Brandon, R.Y. Brizard, C.T. Chieh, and W.B. Pearson, Brasses with F Cells, Acta Crystallogr. Sect. B Struct. Sci., 1977, 33(1), p 30-3610.1107/S0567740877002556 ↗
31. J.K. Brandon, W.B. Pearson, and D.J.N. Tozer, A Single-Crystal X-ray Diffraction Study of the ζ Bronze Structure, Cu20Sn6, Acta Crystallogr. Sect. B Struct. Sci., 1975, 31(3), p 774-77910.1107/S0567740875003780 ↗
32. Y. Watanabe, Y. Fujinaga, and H. Iwasaki, Lattice Modulation in the Long-Period Superstructure of Cu3Sn, Acta Crystallogr. Sect. B Struct. Sci., 1983, 39(3), p 306-31110.1107/S0108768183002451 ↗
33. A. Gangulee, G.C. Das, and M.B. Bever, An X-ray Diffraction and Calorimetric Investigation of the Compound Cu6Sn5, Metall. Trans. A, 1973, 4(9), p 2063-206610.1007/BF02643268 ↗
34. A.K. Larsson, L. Stenberg, and S. Lidin, The Super-Structure of Domain-Twinned eta′-Cu6Sn5, Acta Crystallogr. Sect. B Struct. Sci., 1994, 50, p 636-64310.1107/S0108768194004052 ↗
35. PDF #51-0915, JCPDS-ICDD P. Version 2.2, 2001. Original from: L. Chen, List of Precious Metals, Kunming, P.R. China, Private Communication, 1998
36. S. Arrhenius and A. Westgren, X-radiation Analysis of Copper-Silicon Alloys, Z. Phys. Chem., 1931, 14, p 66-7910.1515/zpch-1931-1408 ↗
37. F.R. Morral and A. Westgren, Ark, Kemi Mineral. Geol. B, 1934, 11, p 1-6
38. K.P. Mukherjee, J. Bandyopadhyay, and K.P. Gupta, Phase Relationship and Crystal Structure of Intermediate Phases in the Cu-Si System in the Composition Range of 17 to 25 at.% Si, Trans. Metall. Soc. AIME, 1969, 245, p 2335-2338