Surface Loss in Ozone-Based Atomic Layer Deposition Processes
Source abstract
Abstract
The recombinative surface loss of O 3 was investigated and its effects on the initial growth, film uniformity, and film conformality in atomic layer deposition (ALD) processes were illustrated. To determine O 3 recombination probabilities over a wide range, a method was developed using high aspect ratio capillaries at the inlet to a mass spectrometer. Using this method, we measured O 3 recombination probabilities ranging from <10 −6 to >10 −3 depending on the composition and temperature of the capillary surface. We utilized these measurements to understand dramatic variations in O 3 loss observed during the initial growth of O 3 -based ALD Pt on Al 2 O 3 and vice versa. Next, we studied the uniformity of O 3 -based ALD using ZnO ALD as a model system. Changes in the spatial uniformity of the ALD ZnO films and the O 3 concentration in the reactor as a function of the O 3 exposure were explained by a transition from reaction- to recombination-limited growth. This explanation was validated using a simple plug-flow model. Finally, we estimated the maximum aspect ratios that can be coated for a given O 3 recombination probability in O 3 -based ALD processes using reasonable cycle times.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Catalytic Processes in Materials Science · Semiconductor materials and devices · Electronic and Structural Properties of Oxides
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
Materials innovation institute, M2i, P.O. Box 5008, 2600 GA Delft, The Netherlands
Eindhoven University of Technology, P.O. Box 513, 5600 MB Eindhoven, The Netherlands
Energy Systems Division, Argonne National Laboratory, Argonne, Illinois 60439, United States
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