Cu-Fe-Si (Copper-Iron-Silicon)
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OpenAlex topics: Microstructure and Mechanical Properties of Steels · Magnetic Properties and Applications · Semiconductor materials and interfaces
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References (11)
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1. Y.A. Chang, Y.P. Neumann, A. Mikula, and D. Goldberg, Copper-Iron-Silicon, Phase Diagrams and Thermodynamic Properties of Ternary Copper-Metal Systems, International Copper Research Association, National Standard Reference Data System, National Bureau of Standards, Washington, DC, 1979, p 492-497
2. V. Raghavan, The Cu-Fe-Si (Copper-Iron-Silicon) System, Phase Diagrams of Ternary Iron Alloys, Part 6B, Indian Institute of Metals, Calcutta, 1992, p 759-767
3. H. Ohtani, H. Suda, and K. Ishida, Solid/Liquid Equilibria in Fe-Cu Based Ternary Systems, ISIJ Int., 1997, 37(3), p 207-21610.2355/isijinternational.37.207 ↗
4. M. Hino, T. Nagasaka, and T. Washizu, Phase Diagram of Fe-Cu-Si Ternary System Above 1523 K, J. Phase Equilib., 1999, 20(3), p 179-18610.1361/105497199770335695 ↗
5. V. Raghavan, Cu-Fe-Si (Copper-Iron-Silicon), J. Phase Equilib., 2002, 23(3), p 267-27010.1361/105497102770331794 ↗
6. C.P Wang, X.J. Liu, I. Ohnuma, R. Kainuma, and K. Ishida, Phase Equilibria in Fe-Cu-X (X: Co, Cr, Si, V) Ternary Systems, J. Phase Equilib., 2002, 23(3), p 236-24510.1361/105497102770331712 ↗
7. J. Miettinen, Thermodynamic Description of the Cu-Fe-Si System at the Cu-Fe Side, CALPHAD, 2003, 27, p 389-39410.1016/j.calphad.2004.01.003 ↗
8. N. Lebrun, P. Perrot, and M. Harmelin, Copper-Iron-Silicon, Landolt-Bornstein Series IV, Vol 11D4, Springer, Berlin, p 1-26
9. V. Raghavan, Cu-Fe-Si (Copper-Iron-Silicon), J. Phase Equilib. Diffus., 2009, 30(1), p 96-9710.1007/s11669-008-9446-1 ↗
10. P. Riani, K. Sufryd, and G. Cacciamani, About the Al-Cu-Si Isothermal Section at 500 °C and the Stability of the ɛ-Cu15Si4 Phase, Intermetallics, 2009, 17, p 154-16410.1016/j.intermet.2008.10.011 ↗
11. J. Zhao, L. Zhang, Y. Du, H. Xu, J. Liang, and B. Huang, Experimental Investigation and Thermodynamic Assessment of the Cu-Fe-Si System, Metall. Mater. Trans. A, 2009, 40, p 1811-182510.1007/s11661-009-9877-2 ↗