Pb-Free Solders: Part III. Wettability Testing of Sn-Ag-Cu-Bi Alloys with Sb Additions
Bibliographic record
Abstract
No abstract is available for this record. The assistant can identify its topic from the title, but cannot infer the study’s results.
Source: Not provided · Quality: missing
Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · 3D IC and TSV technologies · Metallurgical and Alloy Processes
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (11)
Show source-provided references
1. Z. Moser, W. Gasior, K. Bukat, J. Pstruś, R. Kisiel, J. Sitek, K. Ishida, I. Ohnuma, Pb-free Solders. Wettability Testing of Sn-Ag-Cu Alloys With Bi Additions. Part I, J. Phase Equilibria Diff., 2006, 27: 133-139
2. I. Ohnuma, K. Ishida, Z. Moser, W. Gasior, K. Bukat, J. Pstruś, R. Kisiel, J. Sitek, Pb-free solders. Application of ADAMIS data base in modeling of Sn-Ag-Cu alloys with Bi additions. Part II, J. Phase Equilibria Diff., 2006, 27: 245-25410.1361/154770306X109791 ↗
3. J.A.V. Butler, The Thermodynamics of the Surfaces of Solutions, Proc. R. Soc. (London) A, 1932, CXXXV: 348-37510.1098/rspa.1932.0040 ↗
4. I. Ohnuma, X.J. Liu, H. Ohtani, K. Ishida, Thermodynamic Database for Phase Diagrams in Micro-Soldering Alloys, J. Electron. Mater., 1998, 28: 1164-117110.1007/s11664-999-0152-5 ↗
5. Z. Moser, W. Gąsior, K. Ishida, I. Ohnuma, X.J. Liu, K. Bukat, J. Pstruś, J. Sitek, and R. Kisiel, Experimental Wettability Studies Combined with the Related Properties from Data Base for Tin Based Alloys With Silver, Copper, Bismuth and Antimony Additions, 134th Annual Meeting & Exhibition, Book of Final Program, Feb 2005 (San Francisco, CA), Feb 2005, TMS, 2005, p 13-17
6. Z. Moser, W. Gąsior, J. Pstruś, S. Księżarek, Surface Tension and Density of the (Ag-Sn)eut+Cu Liquid Alloys, J. Electron. Mater., 2002, 31: 1225-122910.1007/s11664-002-0013-y ↗
7. W. Gąsior, Z. Moser, J. Pstruś, K. Bukat, R. Kisiel, J. Sitek, Investigations of the (Ag-Sn)eut + Cu Liquid and Solid Solder Materials. Part 1, J. Phase Equilibria, 2004, 25: 115-121
8. Z. Moser, W. Gąsior, J. Pstruś, K. Ishida, I. Ohnuma, R. Kainuma, S. Ishihara, X.J. Liu, Surface Tension and Density of Sn-Ag-Sb Liquid Alloys and Phase Diagram Calculations of the Sn-Ag-Sb Ternary System, Mater. Trans., 2004, 45: 652-66010.2320/matertrans.45.652 ↗
9. M. Miyazaki, M. Mitutani, T. Takemoto, A. Matsunawa, Conditions for Measurement of Surface Tension of Solders with a Wetting Balance Tester, Trans. JWRI, 1997, 26: 81-84
10. Z. Moser, W. Gąsior, J. Pstruś, I. Ohnuma, and K. Ishida, Influence of Sb Additions on Surface Tension and Density of Sn-Sb, Sn-Ag-Sb and Sn-Ag-Cu-Sb alloys: Experiment vs. Modeling. Part 1., Int. J. Mater. Res., Z. Metallkd., 2006, 97, p 365-370. Dedicated to Professor Dr.Ferdinand Sommer on the occasion of his 65th birthday10.3139/146.101225 ↗
11. E.P. Lopez, P.T. Vianco, J.A. Rejent, Solderability testing of Sn-Ag-Xcu Pb-Free Solders on Copper and Au-Ni Plated Kovar Substrates, J. Electron. Mater., 2005, 34: 299-31010.1007/s11664-005-0217-z ↗