Thermally Cross-Linkable Hole-Transporting Materials on Conducting Polymer: Synthesis, Characterization, and Applications for Polymer Light-Emitting Devices
Source abstract
Abstract
A series of novel hole-transporting materials (HTMs) bearing thermally cross-linkable styryl groups have been synthesized and characterized. These HTMs could be in situ cross-linked under mild thermal polymerization without any initiator. The cross-linking temperatures (150–180 °C) for these HTMs are substantially lower than that typically used for curing perfluorocyclobutane (PFCB)-based HTMs (230 °C). After cross-linking, the resultant HTMs form robust, smooth, and solvent-resistant networks, which enables the subsequent spin-coating of emissive layer (EML). The HTMs based on an ether linkage connecting triarylamine dimers exhibited better hole-transporting ability compared to their corresponding monotriarylamine compounds due to higher content and closer distance of the hole-transporting units. Most importantly, the milder cross-linking condition for these HTMs allows the commonly used conducting polymer, poly(3,4-ethylenedioxythiophene):poly(4-styrenesulfonate) (PEDOT:PSS), to be incorporated as the bottom hole-injecting layer to improve turn-on voltage and power efficiency of the devices. This PEDOT/HTM double-layer hole-injecting/hole-transporting configuration also provides the combined advantages of preventing acidic PEDOT:PSS-induced quenching of emission, facilitating cascade hole injection and transport, and functioning as an efficient electron blocker. One of the devices that combines 2-NPD with PEDOT:PSS showed much improved performance of low turn-on voltage (3.3 V), high luminous efficiency (10.8 cd/A), and brightness (21 500 cd/m 2 ).
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Organic Light-Emitting Diodes Research · Organic Electronics and Photovoltaics · Conducting polymers and applications
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
Department of Materials Sciences & Engineering and Institute of Advanced Materials and Technology, University of Washington, Seattle, Washington 98195
References (63)
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